Hole cutter for ostomy adhesive wafers

Details Hole cutter for ostomy adhesive wafers Hole cutter for ostomy adhesive wafers

1990-12-26

1992-01-14

Watts, Douglas D.

Cutlery

Cutting tools

Sweep cutter

30300, B26B 500, B26B 300

Patent

active

050798430

ABSTRACT:
An adjustable size hole cutter for ostomy adhesive wafers is disclosed having firstly a cylindrical body adapted to hold a cutting blade, a cylindrical pilot protruding outward from the bottom circular face of the cylindrical body to reside in a preformed hole in the colostomy wafer, and a Tee handle protruding outward from the top face. Adjustment of the blade's distance from the center of the cylindrical body for cutting different sized holes is accomplished by means of removable adjustment spacers situated in a radial slot formed in the wall of the cylindrical body, the cutting blade secured to the outside adjustment spacer by a set screw passing through a hole in the blade and aligned holes in the adjustment spacers. A circular base plate with centrally located hole receives the pilot of the adjustable hole cutter. The ostomy wafer is placed between the bottom face of the cylindrical body and the base plate whereupon the blade cuts into the wafer and the circular hole cut as the cutter is rotated. In alternate embodiments, slots are selectively situated in the bottom circular face of the cylindrical body to receive a blade at the diameter of choice. In addition, a cylindrical cutter provides for initially making the pilot hole in ostomy wafers not furnished with one.

REFERENCES:
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patent: 1924717 (1933-08-01), Hall
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patent: 3456346 (1969-07-01), Snyder
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patent: 4548118 (1985-10-01), Brosch
patent: 4593467 (1986-06-01), Safar
patent: 4681574 (1987-07-01), Eastman
patent: 4782730 (1988-11-01), Picone et al.
patent: 4817287 (1989-04-01), Arnold
patent: 4911051 (1990-03-01), Depetris

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