Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1982-11-19
1984-01-10
Powell, William A.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
134 29, 134 2216, 134 2217, 156655, 156668, 156902, 252 795, 427 98, 427307, B05D 512, B05D 304, B29C 1708, B44C 122
Patent
active
044253800
ABSTRACT:
An improved process for removing resin smeared on an interior wall of a hole in a resinous substrate and/or adhesion promoting the substrate which comprises: (a) contacting the substrate with an alkaline permanganate treating solution having a pH between about 11 and about 13 and an elevated temperature for a time period sufficient to remove the resin smear; (b) neutralizing essentially all manganese residue on the substrate; (c) contacting the substrate with an alkaline hydroxide etchant to remove the balance of manganese residue on the substrate. A metal such as copper subsequently may be electrolessly deposited in a more efficient and easily controlled manner on the resin substrate in the formation of a wire scribed circuit board or multilayer printed circuit board. In addition to resin smear removal, the process results in an improved bond between copper and the hole wall.
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Bulletin De L'Academie Polonaise Des Sciences, vol. VII, No. 6, 1959, Kinetics and Mechanism of Reduction of Permanganate to Manganate by OH-Ions by B. Jezowska-Trzebiatowska et al., pp. 405-420.
Duffy John K.
Nuzzi Francis J.
Kollmorgen Technologies Corporation
Powell William A.
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