Holding structure of substrates

Details Holding structure of substrates Holding structure of substrates

1985-10-09

1988-02-16

Leung, Philip

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361386, 361414, H05K 720

Patent

active

047259205

ABSTRACT:
A multiple substrate assembly has a metallic plate sandwiched in between two printed circuit substrates. The metallic plate has cut and erect segments passing through thru-holes formed in at least one substrate, so that printed circuit paths on the outer surfaces of the substrates can be grounded to the metallic plate.

REFERENCES:
patent: 3348101 (1967-10-01), Klein et al.
patent: 3506877 (1970-04-01), Owen
patent: 4310870 (1982-01-01), Kia et al.
patent: 4388672 (1983-06-01), Skill
patent: 4498119 (1985-02-01), Cronin

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