Holding structure of an electronic component and a method...

Details Holding structure of an electronic component and a method... Holding structure of an electronic component and a method...

2002-12-04

2008-05-27

Aurora, Reena (Department: 2862)

Electricity: measuring and testing

Magnetic

Displacement

C324S207200

Reexamination Certificate

active

07378840

ABSTRACT:
A holding structure of an electronic component includes a first resin mold formed by resin insert molding with a terminal. The first resin mold possesses a positioning portion for positioning the electronic component to be electrically connected to the terminal. The holding structure includes a second resin mold formed by resin insert molding with the terminal and surrounding the first resin mold and the electronic component. The electronic component has been positioned by the first resin mold and has been electrically connected to the terminal.

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Corresponds to EP 1 096 234 A1.
Official Letter issued by German Patent Office and English language translation of same, 10256709.3-34 May 11, 2007.

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