Holding device and method for treating wafer-like objects, and a

Electric heating – Metal heating – By arc

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B23K 2600

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active

050935500

ABSTRACT:
A wafer holding device including a frame (2) which surrounds a wafer (1) ch is received without contact, which can be moved with the wafer having at least three holding elements (3) which are directed toward the outside circumference of the wafer and which can be changed from a holding position to a release position. The wafer can be supported in the holding device during many steps associated with movement in the production process so that a multiplicity of gripping and release operations which stress the wafer surface are unnecessary.

REFERENCES:
patent: 309680 (1884-12-01), Bapterosses
patent: 4407654 (1983-12-01), Irwin
patent: 4955808 (1990-09-01), Miyagawa

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