Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2002-03-11
2003-11-04
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C174S050510, C361S778000, C361S818000
Reexamination Certificate
active
06643134
ABSTRACT:
CROSS REFERENCE TO RELATED APPLICATION
The present application is based on Japanese Patent Application No 2001-69125, the entire contents of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a holding and heat dissipation structure for a heat generation part which is arranged in a manner that heat generation parts such as resistors used in an electronic control unit (ECU), for example, are held by a print board by the soldering thereby to dissipate the heat generated from the parts.
2. Related Art
Such a kind of the holding and heat dissipation structure for a heat generation part is disclosed in Unexamined Japanese Patent Publication JP 07-86717A shown in FIG.
20
. As shown in
FIG. 20
, the holding and heat dissipation structure for a heat generation part is configured in a manner that through hole
2
is formed at a printed board
1
and the attachment portions
3
a
of a heat dissipation member
3
made of metal are fixed to concave portions
2
a
of the through hole
2
by solder
4
, respectively.
Lead portions
5
b
protruded from the main body
5
a
of a heat generation part
5
are fixed by solder
6
on not-shown land portions formed around the heat dissipation member
3
of the printed board
1
, respectively. Further, the main body
5
a
of the heat generation part
5
is fixed to the heat dissipation member
3
by solder
7
, so that radiation heat from the main body
5
a
of the heat generation part
5
is dissipated by the heat dissipation member
3
.
However, according to the conventional holding and heat dissipation structure of the heat generation part
5
, it is required to form the through hole
2
at the printed board
1
and fix the heat dissipation member
3
as another part at the through hole
2
by the solder
4
. Further, it is required to fix the lead portions
5
b
of the heat generation part
5
with the printed board
1
by the solder
6
and also to fix the main body
5
a
of the heat generation part
5
to the heat dissipation member
3
by the solder
7
. Accordingly, since there are many soldering portions, the cost of the structure becomes high according to the number of the soldering portions and the assembling procedure becomes troublesome.
SUMMARY OF THE INVENTION
Accordingly, the invention has been made in order to solve the aforesaid problem of the conventional technique, and an object of the invention is to provide a holding and heat dissipation structure for a heat generation part which can reduce simply at a low cost the increase of the temperature at soldering portions between the heat generation part and a substrate due to radiation heat from the main body of the heat generation part and also can surely prevent the occurrence of the crack of the solder.
(1) The above problems are solved by a holding and heat dissipation structure for a heat generation part soldered at a substrate and having lead portions protruded from a main body thereof, the holding and heat dissipation structure comprising: a heat shielding plate disposed at a position opposing to the substrate with a predetermined clearance therebetween; and a part housing portion provided on the heat shielding plate for holding the heat generation part therein.
According to the thus configured holding and heat dissipation structure for a heat generation part, the soldering procedure between the substrate and the lead portions protruding from the main body of the heat generation part can be performed in the stable state that the heat generation part is held by the part housing portion of the heat shielding plate. After the soldering procedure, the heat due to the radiation heat from the main body of the heat generation part can be dissipated and shielded by the heat shielding plate, whereby the temperature at the soldered portions can be prevented from being increased. As a result, the magnitude of the thermal stress acting on the soldered portions can be reduced and so the occurrence of the crack of the solder at the soldered portions can be surely prevented.
(2) There is also provided a holding and heat dissipation structure for a heat generation part according to (1), wherein the part housing portion of the heat shielding plate is formed in a concave shape, insertion holes for inserting the lead portions are formed on the part housing portion and the substrate, respectively, the lead portions are inserted into the insertion holes of the part housing portion and the substrate, and the lead portions and land portions of the substrate are fixed to each other by soldering.
According to the thus configured holding and heat dissipation structure for a heat generation part, the insertion holes of the concave part housing portion of the heat shielding plate can be simply formed so as to coincide with the pitch of the lead portions of the heat generation part, and the soldered portions are required only at the portions between the lead portions of the heat generation part and the land portions of the substrate. Accordingly, the increase of the temperature at the soldered portions due to the radiation heat from the main body of the heat generation part can be suppressed simply at a low cost and so the occurrence of the crack of the solder at the soldered portions can be further surely prevented.
(3) There is also provided a holding and heat dissipation structure for a heat generation part according to (2), wherein the lead portions protruding from the main body are inserted into the insertion holes of the part housing portion of the heat shielding plate and the substrate, and the lead portions and the land portions of the substrate are fixed to each other by the soldering in a state that the main body of the heat generation part is separated from a bottom surface of the part housing portion.
According to the thus configured holding and heat dissipation structure for a heat generation part, since the main body of the heat generation part does not directly contact with the heat shielding plate, the deterioration due to the heat of the heat shielding plate can be surely prevented. Further, the heat due to the radiation heat from the main body of the heat generation part can be surely dissipated on the heat shielding plate side from the concave part housing portion, so that the dissipation effect can be improved.
REFERENCES:
patent: 3934177 (1976-01-01), Horbach
patent: 4636916 (1987-01-01), Burt et al.
patent: 5566052 (1996-10-01), Hughes
patent: 5913552 (1999-06-01), McLellan et al.
patent: 6049469 (2000-04-01), Hood, III et al.
patent: 6194656 (2001-02-01), Kondo et al.
patent: 7-86717 (1995-03-01), None
Ashiya Hiroyuki
Maki Yayoi
Tanaka Yoshiyuki
Tolin Gerald
Yazaki -Corporation
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