Holder for surface mount device during reflow

Details Holder for surface mount device during reflow Holder for surface mount device during reflow

2007-11-13

2007-11-13

Levi, Dameon E. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S743000, C361S745000, C361S760000, C361S767000, C361S811000, C174S260000, C257S727000, C438S612000

Reexamination Certificate

active

10954463

ABSTRACT:
Methods and apparatus to couple a device, such as, for example, a surface mount device, with a substrate, such as, for example, a printed circuit, are disclosed. An apparatus, according to one aspect, may include a substrate, a plurality of terminals coupled with the substrate, a conductive bonding material coupled with the plurality of terminals, an electronic device coupled with the conductive bonding material, and a holder that is coupled with the substrate to hold the electronic device. A method, according to one aspect, may include coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder, mounting an electronic device over the terminals with a conductive bonding material disposed therebetween, heating the conductive bonding material to its melting point, and cooling the conductive bonding material.

REFERENCES:
patent: 6020645 (2000-02-01), Ooyabu
patent: 6509530 (2003-01-01), Pearson et al.
patent: 6566611 (2003-05-01), Kochanowski et al.
patent: 6812565 (2004-11-01), Nishimoto et al.
patent: 7000312 (2006-02-01), Fukunabe et al.
patent: 7084353 (2006-08-01), Downes
patent: 7122460 (2006-10-01), Hua
patent: 2004/0169275 (2004-09-01), Danvir et al.

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