Metal fusion bonding – With means to handle work or product – Including means to orient work or position work portion...
Patent
1991-05-20
1992-09-22
Ramsey, Kenneth J.
Metal fusion bonding
With means to handle work or product
Including means to orient work or position work portion...
439 83, 361412, H05K 1304, H05K 334
Patent
active
051489627
ABSTRACT:
This invention relates to soldering systems of the type that provide localized soldering through the use of lasers. Such structures of this type generally allow flexible printed circuit boards to be locally soldered to metallized ceramic substrates. These structures have applications in such areas as ultrasound equipment.
REFERENCES:
patent: 4087146 (1978-05-01), Hudson, Jr.
patent: 4697061 (1987-09-01), Spater et al.
patent: 4799755 (1989-01-01), Jones
patent: 4926022 (1990-05-01), Freedman
patent: 4978307 (1990-12-01), Billman et al.
Harrison Jerry T.
Jones Marshall G.
Piel, Jr. Joseph E.
Smith Lowell S.
General Electric Company
McDaniel James R.
Ramsey Kenneth J.
Webb II Paul R.
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