Holder for soldering a flexible circuit board to a substrate

Metal fusion bonding – With means to handle work or product – Including means to orient work or position work portion...

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Details

439 83, 361412, H05K 1304, H05K 334

Patent

active

051489627

ABSTRACT:
This invention relates to soldering systems of the type that provide localized soldering through the use of lasers. Such structures of this type generally allow flexible printed circuit boards to be locally soldered to metallized ceramic substrates. These structures have applications in such areas as ultrasound equipment.

REFERENCES:
patent: 4087146 (1978-05-01), Hudson, Jr.
patent: 4697061 (1987-09-01), Spater et al.
patent: 4799755 (1989-01-01), Jones
patent: 4926022 (1990-05-01), Freedman
patent: 4978307 (1990-12-01), Billman et al.

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