Holder for flat subjects in particular semiconductor wafers

Abrading – Work holder – Vacuum

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Details

451288, 451398, B24B 4700

Patent

active

060930918

ABSTRACT:
A holder for flat subjects, in particular semiconductor wafers, in particular in a device for the chemical-mechanical polishing of semiconductor wafers, with a plate-like head which can be connected on the upper side to a height adjustable spindle and at the lower side comprises a holding plate which is coupled to a carrier section arranged above the holding plate via a universal joint and which comprises a number of vertical bores which extend to the lower side of the plate and can be connected to a vacuum and/or a fluid source, wherein the holding plate is height adjustably guided in the carrier section, between the carrier section and the holding plate there is arranged an annular closed membrane within which there is formed an essentially air-tightly closed inner space which can be selectively connected to atmosphere or vacuum or to a pressure source.

REFERENCES:
patent: 5216846 (1993-06-01), Takahashi
patent: 5681215 (1997-10-01), Sherwood et al.
patent: 5716258 (1998-02-01), Metcalf
patent: 5795215 (1998-08-01), Guthrie et al.
patent: 5957751 (1999-09-01), Govzman et al.
Company document "CMP Cluster Tool System Planarization Chemical Mechanical Polishing" of Peter Wolters of Mar. 1996.

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