Hinged circuit assembly with multi-conductor framework

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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174 524, 439709, 439721, 439723, H01L 2328, H01R 922

Patent

active

056190123

ABSTRACT:
A circuit assembly is made by overmolding, with an electrically insulating material, a unitary framework of electrically conductive material forming coplanar conductors which are connected to each other by an integral structural member. The overmolded material secures the conductors relative to each other and enables portions of the structural member to be severed, electrically isolating the conductors from each other. The overmolded material also positions electrical components having leads that are electrically connected to the conductors. Ends of the conductors are formed into terminals which extend out of a hinge formed in the overmolded material. The hinge enables the terminals to be oriented in a different plane than the conductors.

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