Highly thermally conductive yet highly comformable alumina fille

Details Highly thermally conductive yet highly comformable alumina fille Highly thermally conductive yet highly comformable alumina fille

1996-11-05

1999-07-27

Morgan, Kriellion S.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523223, 524430, 524437, 524786, 524862, C08K 716, C08K 318, C08K 310, C08L 8304

Patent

active

059291389

ABSTRACT:
A highly thermally conductive but yet highly conformable composition is made from gel filled with alumina. The use of .alpha.-alumina in which at least 10 weight % of the .alpha.-alumina particles have a particle size of at least 74 .mu.m makes possible the high filler levels needed to attain high thermal conductivity, without causing the decrease in elongation and softness normally associated with high filler levels. Further improvements are observed if the .alpha.-alumina and the gel (or precursor thereof) are mixed with a specific energy input of at least 10 Joule/g. The input of such specific energy has the effect making the resulting composition more conformable than it otherwise would be. The composition may be internally supported by a flexible matrix such as a fabric or open-celled foam.

REFERENCES:
patent: 3020260 (1962-02-01), Nelson
patent: 4237441 (1980-12-01), van Konynenberg et al.
patent: 4369284 (1983-01-01), Chen
patent: 4373239 (1983-02-01), Henry et al.
patent: 4548862 (1985-10-01), Hartman
patent: 4574879 (1986-03-01), DeGree et al.
patent: 4585822 (1986-04-01), Streusand
patent: 4595635 (1986-06-01), Dubrow et al.
patent: 4600261 (1986-07-01), Debbaut
patent: 4634207 (1987-01-01), Debbaut
patent: 4643924 (1987-02-01), Uken et al.
patent: 4680233 (1987-07-01), Camin et al.
patent: 4690831 (1987-09-01), Uken et al.
patent: 4701574 (1987-10-01), Shimirak et al.
patent: 4716183 (1987-12-01), Gamarra et al.
patent: 4741940 (1988-05-01), Reed
patent: 4777063 (1988-10-01), Dubrow et al.
patent: 4852646 (1989-08-01), Dittmer et al.
patent: 4865905 (1989-09-01), Uken
patent: 4900877 (1990-02-01), Dubrow et al.
patent: 4942270 (1990-07-01), Gamarra
patent: 5008307 (1991-04-01), Inomata
patent: 5021494 (1991-06-01), Toya
patent: 5060114 (1991-10-01), Feinberg et al.
patent: 5079300 (1992-01-01), Dubrow et al.
patent: 5104930 (1992-04-01), Rinde et al.
patent: 5140746 (1992-08-01), Debbaut
patent: 5357057 (1994-10-01), Debbaut
patent: 5530060 (1996-06-01), Fujiki et al.
"Aluminum Oxide (Alumina)," in Kirk-Othmer Encyclopedia of Chemical Technology, vol. 2, 3rd Ed., pp. 218-244 (1978).
Beavis et al., AICHE Symp. Ser. (1985), vol. 81 (245, Heat Transfer), pp. 1-6.
Hansen et al., Polym. Eng. Sci., vol. 15, No. 5, pp. 353-356 (May 1975).
Peterson, IEEE 40th Electronic Components and Technology Conf. (May 1990), pp. 613-619.
Progelhof et al., Polym. Eng. Sci., vol. 16, No. 9, pp. 615-625 (Sep. 1976).
Reed, "Principles of Ceramics Processing," 2nd Ed., pp. 40-42 (John Wiley & Sons 1995).
WPI Abstract No. 940216382/26 (abstract of TW 94101309).

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