Highly reliable hermetically sealed package for a semiconductor

Details Highly reliable hermetically sealed package for a semiconductor Highly reliable hermetically sealed package for a semiconductor

1983-03-23

1985-12-10

Davie, James W.

29589, 357 71, H01L 2160, H05K 109

Patent

active

045583463

ABSTRACT:
A semiconductor device having a hermetically sealed package which includes a package substrate having a gold layer, an integrated-circuit chip attached to the gold layer, a terminal metal chip attached to the gold layer so as to ground the terminal metal chips leads, bonding wires, a cap, and glass layers for sealing the device. The terminal metal chip has a lower coating layer made of a gold-silicon type of alloy for attachment. The bond strength of the terminal metal chip is not decreased although a heat treatment is carried out to seal the glass.

REFERENCES:
patent: 4447857 (1984-05-01), Marks et al.

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