Highly-oriented diamond film heat dissipating substrate

Stock material or miscellaneous articles – Self-sustaining carbon mass or layer with impregnant or...

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428446, 428704, H01L 310312

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active

055298460

ABSTRACT:
The present invention relates to a heat dissipating substrate with a highly-oriented diamond film of a low crystal inclination and a low density grain boundaries and having a significantly high thermal conductivity. At least 90% of the surface area of the highly-oriented diamond film is covered with either (100) or (111) crystal planes, and the differences {.DELTA..alpha., .DELTA..beta., .DELTA..gamma.} of the Euler angles, which represent the orientations of the crystals, between adjacent (100) or (111) crystal planes, simultaneously satisfies the following relationship: .vertline..DELTA..alpha..vertline..ltoreq.5.degree., .vertline..DELTA..beta..vertline..ltoreq.5.degree., and .vertline..DELTA..gamma..vertline..ltoreq.5.degree.. In addition, this highly-oriented diamond film can be grown on a non-diamond substrates, and therefore the diamond film with a large surface area can be obtained. Thus, the present invention provides the heat dissipating substrate with an excellent thermal conductivity at low cost.

REFERENCES:
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patent: 5066938 (1991-11-01), Kobashi et al.
patent: 5089802 (1992-02-01), Yamazaki
patent: 5144380 (1992-09-01), Kimoto et al.
patent: 5183530 (1993-02-01), Yamazaki
Geis "Growth of textured diamond films on foreign substrates from attached seed crystals" App. Phy. Let 55(6) Aug. 7, 1989, pp. 550-552.
U.S. Patent Application Serial No. 07/811,425, filed Dec. 20, 1991, Nucleation Enhancement for Chemical Vapor Deposition of Diamond, Stoner et al., now abandoned.
U.S. Patent Application Serial No. 07/937,481, filed Aug. 28, 1992, Nucleation Enhancement for Chemical Vapor Deposition of Diamond, Stoner et al., allowed Mar. 28, 1994.
U.S. Patent Application Serial No. 08/035,643, filed Mar. 23, 1993, Microelectronic Structure Having an Array of Diamond Structures on a Nondiamond Substrate and Associated Fabrication Methods, Dreifus et al., pending.

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