Highly integrated universal tape bonding

Details Highly integrated universal tape bonding Highly integrated universal tape bonding

1985-04-01

1985-11-12

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29589, 29591, H01L 2160

Patent

active

045519129

ABSTRACT:
A method of forming semiconductor devices wherein a continuous metallic sheet is cut under computer control into a personalized lead pattern. The pattern is then moved to a bonding station. A bonding tool actuated by computer control moves from one terminal end to another to sequentially bond terminals to the semiconductor device. A variety of various patterns and chips can be handled on the same line using common cutting and bonding tools. A second bond can be made from the lead pattern to either a lead frame or a substrate.

REFERENCES:
patent: 3698075 (1972-10-01), Boyle
patent: 3709424 (1973-01-01), Drees
patent: 3761675 (1973-09-01), Mason et al.
patent: 3793714 (1974-02-01), Bylander
patent: 3903363 (1975-09-01), Montone et al.
patent: 4209355 (1980-06-01), Burns
patent: 4396457 (1983-08-01), Bakermans

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