Highly integrated electronic component with heat-conducting plat

Details Highly integrated electronic component with heat-conducting plat Highly integrated electronic component with heat-conducting plat

1991-07-09

1993-07-06

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257675, 257796, 361388, H01L 2328

Patent

active

052257100

ABSTRACT:
A highly integrated electronic component comprised of a semiconductor body cast into a plastics enclosure. A multiplicity of metallic terminals protrude from the plastic enclosure, and a heat-conducting plate is cast into the plastic enclosure and is in surface contact with an underside of the semiconductor body. Good heat removal and an increase in the mechanical stability for the terminals are achieved by the heat-conducting plate being substantially planar and bearing both against the underside of the semiconductor body and against the underside of the terminals and by the upper side of the heat-conducting plate having a thin, electrically insulating layer.

REFERENCES:
patent: 4862246 (1989-08-01), Masuda et al.
patent: 4884124 (1989-11-01), Mori et al.
patent: 4947237 (1990-08-01), Fusaroli
patent: 5006919 (1991-04-01), Disko
patent: 5032895 (1991-07-01), Horiuchi et al.
patent: 5041902 (1991-08-01), McShane
Rudolf F. Graf, Radio Shack Dictionary of Electronics, Second Edition, p. 36, 1978, Indianapolis, Indiana, Sams & Co., Inc.
IBM Technical Disclosure Bulletin, "Flat Package Using Three-Layer Film", vol. 31, No. 8, Jan. 1989, p. 119.
"Calculation/Dimensioning of Heat Dissipation Members with Pre-Designed Profile", ELO. 1980, p. 66, No Author.

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