Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent
1998-06-26
1999-11-02
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
257778, 257780, 257738, 257686, 361729, 361735, H01L 2348
Patent
active
059776404
ABSTRACT:
The advantages of the invention are realized by a chip-on-chip module having at least two fully functional chips, electrically connected together, and a chip-on-chip component connection/interconnection for electrically connecting the fully functional chips to external circuitry.
REFERENCES:
patent: 4703483 (1987-10-01), Enomoto et al.
patent: 5109320 (1992-04-01), Bourdelaise et al.
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 5401672 (1995-03-01), Kurtz et al.
patent: 5434453 (1995-07-01), Yamamoto et al.
patent: 5446247 (1995-08-01), Cergel et al.
patent: 5495394 (1996-02-01), Kornfeld et al.
patent: 5541449 (1996-07-01), Crane, Jr. et al.
patent: 5563773 (1996-10-01), Katsumata
patent: 5576519 (1996-11-01), Swamy
patent: 5600541 (1997-02-01), Bone et al.
patent: 5760478 (1998-06-01), Bozso et al.
patent: 5790384 (1994-08-01), Ahmad et al.
IBM Technical Disclosure Bulletin, vol. 22 No. 10 Mar. 1980, High Performance Package with Conductive Bonding to Chips, Coombs et al., 2 pages.
IBM Technical Disclosure Bulletin, vol. 14 No. 6 Nov. 1971, Chip Joining Process, Lavanant et al., 2 pages.
Interconnect Reliability of Ball Grid Array and Direct Chip Attach, Topic 2, Andrew Mawer, 17 pages.
IBM Technical Disclosure Bulletin, vol. 10 No. 5, Semiconductor Chip Joining, Miller et al., 2 pages.
IBM Technical Disclosure Bulletin, vol. 31 No. 2 Jul. 1988, Plastic Package for Semiconductors with Integral Decoupling Capacitor, Howard et al., 2 pages.
IBM Technical Disclosure Bulletin, vol. 36 No. 12 Dec. 1993, Postage Stamp Lamination of Reworkable Interposers for Direct Chip Attach, pp. 487 and 488.
Bertin Claude Louis
Ference Thomas George
Howell Wayne John
Sprogis Edmund Juris
International Business Machines - Corporation
Thai Luan
Thomas Tom
Walter, Jr. Howard J.
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