Highly heat-sensitive film for stencil

Details Highly heat-sensitive film for stencil Highly heat-sensitive film for stencil

1986-07-14

1988-08-23

Ives, P. C.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

428340, 428481, 4284796, 428227, 428229, 428364, 428442, 428518, 428910, 428516, 4284761, 427143, 2641761, B32B 2706, B41C 114, B41N 124

Patent

active

047660333

ABSTRACT:
The present invention relates to a highly sensitive heat-sensitive film for stencil. This invention provides a highly heat-sensitive film for stencil, comprising a thermoplastic resin having a coefficient of temperature and melt viscosity (.DELTA.T/.DELTA. log VI) of not more than 100 and a thermal shrinkage (X%) at 100.degree. C. and a thermal shrinkage stress (Y g/mm.sup.2) at 100.degree. C. falling respectively in the ranges of the formulas; 15.ltoreq.X.ltoreq.80 and 75.ltoreq.Y.ltoreq.500; and both falling in the range of the formula; -8X+400.ltoreq.Y.ltoreq.-10X+1000; having a thickness in the range of 0.5 to 15 .mu.m, and excelling in low-energy perforation property.
The film of this invention is superior in a low temperature perforation property, capable of being perforated with a low energy thermal head or with a low energy flash irradiation for making a plate; expansion of perforations is small when the film is perforated; and its change with time (dimensional change) is small and its sizes are stable.

REFERENCES:
patent: 3595166 (1971-07-01), Sherman
patent: 3696742 (1972-10-01), Parts et al.
Derwent Pub. Ltd., 85-155305/26, J6 0085-996-A, Dynic Corp., "Heat Sensitive Mimeograph Plate", Dyni 10-18-83.

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