Highly heat-resistant positive resists comprising end-capped hyd

Details Highly heat-resistant positive resists comprising end-capped hyd Highly heat-resistant positive resists comprising end-capped hyd

1992-05-07

1994-12-27

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

430165, 430193, 430906, 525426, 525434, 528310, 528332, G03F 7023, G03F 730

Patent

active

053764994

ABSTRACT:
Cost-effective, highly heat-resistant positive resists based on oligomer and/or polymer polybenzoxazole precursors and diazo quinones possess a high [level of] stability in storage when the polybenzoxazole precursors are hydroxypolyamides of the following structure: ##STR1## whereby R, R*, R.sub.1, R*.sub.1, and R.sub.2 are aromatic groups, R.sub.3 is an aliphatic, cycloaliphatic or aromatic group having at least one alkenyl or alkynyl grouping and, with respect to n.sub.1, n.sub.2 and n.sub.3, the following applies:

REFERENCES:
patent: 4339521 (1982-07-01), Ahne et al.
patent: 4371685 (1983-02-01), Ahne et al.
patent: 4395482 (1983-07-01), Ahne et al.
patent: 4622285 (1986-11-01), Ahne
patent: 4849051 (1989-07-01), Ahne et al.
patent: 5021320 (1991-06-01), Mueller et al.
patent: 5081000 (1992-01-01), Kuehn et al.

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