Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-07-17
1997-10-07
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 163, 165 802, 165 803, 165185, 257678, 257707, 257712, 361707, 361708, 361715, H05K 720
Patent
active
056754744
ABSTRACT:
Highly heat-radiating ceramic packages comprising a multi-layer ceramic wiring board 11 to one surface of which is bonded a heat-radiating ceramic base plate 13 with first and second aluminum plates 31 and 32 bonded to both surfaces thereof, via the first aluminum plate 31 are free from warping and cracking, and have improved heat-radiation performance and lower weight and manufacturing cost. The ceramic base plate 13 and the multi-layer ceramic wiring board 11 may be constructed with the same or different types of ceramic which are selected from the group consisting of alumina, glass ceramic, aluminum nitride, mullite, and silicon carbide. The two aluminum plates 31 and 32 are bonded to the ceramic base plate 13 with an Al-Si brazing material. Improved levels of heat radiation performance are accomplished by bonding a heat-radiating ceramic base plate with an aluminum plate bonded thereto, to a multi-layer wiring board prepared even by low-temperature sintering.
REFERENCES:
patent: 5297006 (1994-03-01), Mizukoshi
patent: 5455382 (1995-10-01), Kojima et al.
patent: 5513070 (1996-04-01), Xie et al.
Hatsushika Masafumi
Kanda Yoshio
Kuromitu Yoshiro
Nagase Toshiyuki
Tanaka Hirokazu
Mitsubishi Materials Corporation
Thompson Gregory D.
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