Highly conductive polyoxymethylene resin composition containing

Compositions – Electrically conductive or emissive compositions – Elemental carbon containing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

252510, 524495, 524496, 523468, H01B 124

Patent

active

052079490

ABSTRACT:
A highly conductive resin composition comprising:

REFERENCES:
patent: 4277577 (1981-07-01), Burg et al.
patent: 4391741 (1983-07-01), Masamoto et al.
patent: 4395362 (1983-07-01), Satoh et al.
patent: 4555357 (1985-11-01), Kausga et al.
patent: 4780498 (1988-10-01), Goerrissen et al.
patent: 4828755 (1989-05-01), Kusumgar
patent: 4873282 (1989-10-01), Yui et al.
patent: 4909960 (1990-03-01), Watanabe et al.
patent: 4909961 (1990-03-01), Suzuki et al.
patent: 4933107 (1990-06-01), Watanabe et al.
patent: 5036120 (1991-07-01), Orikasa et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Highly conductive polyoxymethylene resin composition containing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Highly conductive polyoxymethylene resin composition containing , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Highly conductive polyoxymethylene resin composition containing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1973256

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.