Highly conductive, multi-layer composite precursor...

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Reexamination Certificate

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C428S689000, C428S697000, C428S699000, C429S006000, C429S006000, C429S006000, C429S047000

Reexamination Certificate

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07887927

ABSTRACT:
This invention provides a moldable, multiple-layer composite composition, which is a precursor to an electrically conductive composite flow field plate or bipolar plate. In one preferred embodiment, the composition comprises a plurality of conductive sheets and a plurality of mixture layers of a curable resin and conductive fillers, wherein (A) each conductive sheet is attached to at least one resin-filler mixture layer; (B) at least one of the conductive sheets comprises flexible graphite; and (C) at least one resin-filler mixture layer comprises a thermosetting resin and conductive fillers with the fillers being present in a sufficient quantity to render the resulting flow field plate or bipolar plate electrically conductive with a conductivity no less than 100 S/cm and thickness-direction areal conductivity no less than 200 S/cm2.

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U.S. Appl. No. 11/293,540, filed Dec. 5, 2005, Jang.
U.S. Appl. No. 11/293,541, filed Dec. 5, 2005, Jang, et al.

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