Compositions: coating or plastic – Coating or plastic compositions – Marking
Reexamination Certificate
2006-05-24
2010-10-05
Mc Ginty, Douglas (Department: 1796)
Compositions: coating or plastic
Coating or plastic compositions
Marking
C252S500000, C252S512000, C252S513000, C252S514000, C252S519200, C427S466000
Reexamination Certificate
active
07806974
ABSTRACT:
A viscosity controllable highly conductive ink composition. The highly conductive ink composition comprises an organic solvent, nanoscale metal particles or metallo-organic decomposition compounds, and a thermally decomposable organic polymer. Specifically, since the thermally decomposable polymer can increase the viscosity of the highly conductive ink composition and be removed by subsequent thermal treatment, so as to decrease the impact on conductivity by organic polymer. Therefore, a viscosity-controllable conductive ink composition is obtained.
REFERENCES:
patent: 5882722 (1999-03-01), Kydd
patent: 6322620 (2001-11-01), Xiao
patent: 2004/0214920 (2004-10-01), Aoshima
patent: 2005/0046675 (2005-03-01), Aoshima
patent: 2005/0046683 (2005-03-01), Kasai
patent: 2005/0129843 (2005-06-01), Wu et al.
patent: 5217417 (1993-08-01), None
patent: 588096 (1990-11-01), None
patent: 473738 (2002-01-01), None
patent: 505685 (2002-10-01), None
patent: 238117 (2005-08-01), None
patent: WO-2004/067647 (2004-08-01), None
K.F. Teng et al., Liquid Ink Jet Print with MOD Inks for Hybrid Microcircuits, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Dec. 1987, 545-549, CHMT-12-4.
Hwang Gue-Wuu
Ko Bao-Tsan
Lin Yi-Shin
Birch & Stewart Kolasch & Birch, LLP
Ginty Douglas Mc
Industrial Technology Research Institute
Nguyen Haidung D
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