Highly conductive composition for wafer coating

Details Highly conductive composition for wafer coating Highly conductive composition for wafer coating

2007-01-10

2008-09-09

Kopec, Mark (Department: 1796)

Compositions

Electrically conductive or emissive compositions

C252S512000, C252S514000, C075S252000, C257S768000, C361S502000, C438S689000

Reexamination Certificate

active

07422707

ABSTRACT:
A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns, a first resin that has a softening point between 80-260° C., solvent, curing agent, and a second resin, wherein at room temperature the first resin is substantially soluble in the solvent.

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