High yield combined rigid and flexible printed circuits and meth

Details High yield combined rigid and flexible printed circuits and meth High yield combined rigid and flexible printed circuits and meth

1990-07-24

1991-12-10

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174256, 174259, 361398, 361414, 156251, 156123, H05K 100

Patent

active

050720740

ABSTRACT:
This is a printed circuit comprising multiple layers and rigid and flexible portions and including a sheet of flexible substrate material extending over the entirety of the rigid and flexible portions and paths of conductive material carried by at least one side of the sheet of flexible substrate material. This invention comprises, a sheet of flexible over-layer material extending over at least the entirety of all the flexible portions; a flexible adhesive material adhesively attaching the sheet of flexible over-layer material to the entirety of all the flexible portions; sheets of a rigid substrate material extending over the entirety of all the rigid portions; and, a rigid adhesive material adhesively attaching the sheets of a rigid substrate material to the entirety of all the rigid portions. The rigid adhesive attaching the sheets of rigid substrate to the rigid portions may extend out over the edge of the rigid portions onto the flexible portions to form a protective edge. The sheet of flexible over-layer material may also extend over the rigid portions and be attached with a rigid adhesive.

REFERENCES:
patent: 4533787 (1985-08-01), Anderegg et al.
patent: 4800461 (1989-01-01), Dixon et al.
Messerschmitt, Multilayered Circuit Board Mfg. Method, Derwent Publications Ltd., v-4, 1987.

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