High withstand voltage semiconductor device with shallow grooves

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 13, 357 38, 357 52, 357 56, H01L 2906

Patent

active

039848590

ABSTRACT:
In a high-withstand-voltage (high-breakdown voltage) semiconductor device in which the main PN junction is of planar structure and a field limiting ring region is provided outside and around the exposed end of the main PN junction, a groove is formed between the main region to form the main PN junction and the field limiting ring region, the bottom of which groove is shallower than that of each of the regions and in the surface of which groove the end of the main PN junction and one of the ends of the PN junction between the field limiting ring region and the substrate are exposed, and the other end of the PN junction between the field limiting ring region and the substrate is exposed in the surface of another groove whose bottom is deeper than that of the field limiting ring region.

REFERENCES:
patent: 3335296 (1967-08-01), Smart
patent: 3391287 (1968-07-01), Kao et al.
patent: 3445303 (1969-05-01), Engbert
patent: 3506502 (1970-04-01), Nakamura
patent: 3535774 (1970-10-01), Baker
patent: 3538398 (1970-11-01), Whiting
patent: 3555373 (1971-01-01), Kawana et al.
patent: 3608186 (1971-09-01), Hutson
patent: 3751722 (1973-08-01), Richman
patent: 3821782 (1974-06-01), Hutson
patent: 3832246 (1974-08-01), Lynch

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High withstand voltage semiconductor device with shallow grooves does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High withstand voltage semiconductor device with shallow grooves, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High withstand voltage semiconductor device with shallow grooves will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-659530

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.