High withstand voltage-semiconductor device with shallow grooves

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357 13, 357 34, 357 50, 357 52, 357 53, B43K 2102, B43K 2104, H01L 2990, H01L 2972

Patent

active

039940110

ABSTRACT:
In a semiconductor device which has a semiconductor substrate, a semiconductor region of opposite conductivity type with respect to the substrate and formed in one principal surface of the substrate of the planar type, and a field limiting ring formed in the one principal surface so as to surround the semiconductor region, there is provided a high breakdown voltage-semiconductor device which comprises a concave portion. The concave portion is formed between the semiconductor region and the field limiting ring so that the PN junctions between the semiconductor region and the substrate and between the field limiting ring and the substrate may be exposed to the concave portion. The concave portion is shallower than the semiconductor region and the field limiting ring, and is filled with an insulator material.

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W. B. French, "Technique for Reducing Surface Leakage and Surface Breakdown in Semiconductor Devices," RCA Tech. Note, No. 919 (10/72) 2 pages.

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