Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
1999-04-05
2001-10-16
Maki, Steven D. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C029S525000, C156S286000, C156S294000, C156S305000, C156S312000, C156S382000, C174S0720TR, C264S262000
Reexamination Certificate
active
06302987
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates generally to polymer processing techniques and more particularly to a processing system for sealing power feed-through bushings in high voltage (such as 2300 volts and 4160 volts, for example) laminated bus structures.
When through holes are machined in laminated bus structures, the machined surfaces are not perfectly smooth, and voids occur between the later inserted bushings and the bus side walls. These voids can result either during fabrication or after subsequent mechanical assembly, or movement or heat changes, for example. These voids can cause initial electrical failures or may become partial discharge electrical failures on initially good buses as they deteriorate over time, particularly when salt or other contaminants are introduced.
Voids (from air bubbles or cracks, for example) on the order of about 25 micrometers or more in diameter can create electrical partial discharges and lead to electrical failures. The larger the void and the greater the density of voids, the greater the risk of failure.
BRIEF SUMMARY OF THE INVENTION
Thus there is a particular need for a process for manufacturing high voltage electrical laminated bus structures for interconnecting large banks of capacitors, insulated gate bipolar transistors, and other components for large motor drive controllers at low cost and high reliability and for the resultant structures. More specifically, there is a need to electrically seal power feed-through bushings in laminated bus structures such that voids which cause partial discharge are removed and prevented and that contaminates cannot enter and cause long term reliability problems.
Briefly, in accordance with one embodiment of the present invention, voids are reduced from a polymer mixture by applying pressure to destroy or to reduce the size of the voids.
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Gorczyca Thomas Bert
Reed Clive William
Wojnarowski Robert John
Agosti Ann M.
Breedlove Jill M.
General Electric Company
Maki Steven D.
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