High voltage MOS field effect semiconductor device

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357 2314, 357 41, 357 50, 357 52, 357 53, 357 54, 357 55, 357 237, H01L 2504

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049262432

ABSTRACT:
A high voltage MOS field-effect semiconductor device comprising, as formed on a single seimconductor substrate a high voltage first MOS field-effect transistor and a conventional second MOS field-effect transistor operable at a lower voltage than the first transistor. The semiconductor substrate is covered with an aluminum or like conductor layer over the region thereof where the conventional second field-effect transistor is located.

REFERENCES:
patent: 4177480 (1979-12-01), Hintzmann
patent: 4194214 (1980-03-01), Awan et al.
patent: 4290077 (1981-09-01), Ronen
patent: 4519050 (1985-05-01), Folmsbee
patent: 4536941 (1985-08-01), Kuo et al.
A. G. Fortino et al., Method of Making a Submicron Field-Effect Transistor, IBM Technical Disclosure Bulletin, vol. 23, No. 2, pp. 534-556, (Jul., 1980).
T. Yamaguchi et al., Process and Device Design of a 1000-V MOS IC, IEEE Transactions on Electron Devices, vol. ED-29, No. 8, pp. 1171-1178, (Aug. 1982).
L. D. Hartsough et al., Aluminum and Aluminum Alloy Sputter Deposition for VLSI, Solid State Technology, pp. 66-72, (Dec., 1979).

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