Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1994-05-16
1996-11-19
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257705, 257707, 257712, 257713, 257717, 257718, 257719, 257721, H01L 2310, H01L 2334
Patent
active
055765785
DESCRIPTION:
BRIEF SUMMARY
The invention relates to an insulating disk composed of electrically insulating and thermally conducting material.
Such insulating disks are used in a liquid cooling of an electrical component, in particular a semiconductor component, which is disposed in an electrically insulating and thermally conducting manner on a heat sink, in particular a cooling box. In this situation, said insulating disk is introduced between cooling box and semiconductor component. In the case of such a thin insulating disk having plane-parallel surfaces, a partial discharge sets in early, creeping discharges form, and the flashover resistance is low and can hardly be increased by increasing the creepage path.
German Utility Model 86 14 173 discloses an insulating cell which is used for the double-sided cooling of presspack-cell semiconductors. Said insulating cell has a disk shape and resembles externally the standard disk semiconductors in its dimensions. The centerpiece is a beryllium oxide (BeO) disk approximately 3 mm thick which has high electrical insulation but good thermal conduction and which is flanked by two metal plates composed of material with good thermal conduction, preferably copper, for the purpose of good thermal contact and for protection. This arrangement is surrounded and held together by an epoxy resin extrusion. Said metal plates also have a smaller diameter than the diameter of the beryllium oxide disk and they additionally taper in the direction of the contact with the beryllium oxide disk. In addition, aluminum oxide (Al203) is also known as an insulating material. Although such an insulating cell is highly insulating, has very good thermal conduction and is insensitive to pressure, it is also of very expensive design.
German Offenlegungsschrift 37 40 233 discloses a cooling box for removing the heat loss from semiconductors which, if service water is used as cooling liquid; contains an insulating plate composed of inorganic insulating material. The cooling box comprises two shells having two connecting pipes for supplying and removing the cooling liquid, cooling ribs being disposed inside said shells, and contact plates for receiving the heat released by the semiconductor element and distributing it to the cooling liquid. The insulating plate composed of inorganic material is disposed between the contact plate and the shell. The diameter of the insulating plate is larger than the diameter of the shell and of the contact plate. To increase the creepage paths, the cooling box, with the exception of the contact surface and the hydraulic connections, is encased in plastic. Beryllium oxide (BeO) or aluminum oxide (Al.sub.2 O.sub.3) is provided as inorganic material. In addition, the insulating plate has circular, solderable metallizations on both sides, these being smaller than the outside diameter of the insulating plate and equal to the diameter of the shell or the contact plate. As a result of this design of the cooling box, cooling can be carried out with normal water and no glow discharges, which occur in the case of insulating disks described at the outset (low glow-voltage strength), occur.
German Offenlegungsschrift 39 37 130 discloses a box cooling device for cooling electrical components, in which the cooling box is encased in a 1 mm to 3 mm thin insulating layer which comprises encapsulating and/or laminating resin composed of unsaturated polyester and/or epoxy resins (thermosetting plastic) and/or a modified polystyrene (thermoplastic material). The insulating layer is surrounded on the outside by a contact box having good electrical conductivity, for example a copper box. As a result of this design of the box cooling device, normal water can be used as cooling liquid and the compact construction permits a simple and rapid replacement. The contact box connects the two contact surfaces electrically, which is disadvantageous in individual cases.
The object of the invention is therefore to provide an insulating disk which no longer; has the disadvantages cited.
This object is achieved according to
REFERENCES:
patent: 3592988 (1971-03-01), Pucher
patent: 3662086 (1972-05-01), Hessinger
patent: 4703339 (1987-10-01), Matsuo
Patent Abstracts Of Japan, JP 1042135, Jun. 6, 1989.
Patent Abstracts Of Japan, JP 55024464, Apr. 25, 1980.
Patent Abstracts Of Japan, JP 61051947, Jul. 25, 1986.
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Fuhrer Wolfgang
Niermeyer Olaf
Papp Gyorgy
Clark Jhihan
Jackson Jerome
Siemens Aktiengesellschaft
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