High vertical aspect ratio thin film structures

Details High vertical aspect ratio thin film structures High vertical aspect ratio thin film structures

1995-06-06

2000-01-18

Speer, Timothy M.

Stock material or miscellaneous articles

Hollow or container type article

Glass, ceramic, or sintered, fused, fired, or calcined metal...

428116, 428167, 428188, 251 14, 200329, B32B 312

Patent

active

06015599&

ABSTRACT:
This invention relates to the area of microelectromechanical systems in which electronic circuits and mechanical devices are integrated on the same silicon chip. The method taught herein allows the fabrication of thin film structures in excess of 150 microns in height using thin film deposition processes. Wafers may be employed as reusable molds for efficient production of such structures.

REFERENCES:
patent: 5645684 (1997-07-01), Keller

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