Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-05-16
2009-08-11
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679480, C361S679330, C361S695000, C165S080300, C454S184000
Reexamination Certificate
active
07573713
ABSTRACT:
Systems and methods for cooling electronic components are disclosed herein. Certain aspects of the invention are directed toward an electronic system that includes an electronic module having a container with at least two openings and multiple manufactured electronic components carried in the container. The electronic module is configured to operate reliably at or above a maximum manufacturer's suggested first ambient temperature while still maintaining the first suggested operating core temperature of the internal electronic module. The system further includes a duct in fluid communication with at least one of the openings and an exterior flow device coupled to the duct. The flow device is configured to produce a pressure differential between an interior and an exterior of the container to cause high velocity air to flow through the container such that the electronic module can be operated in the selected mode at a second ambient temperature greater than the maximum first manufacturer's suggested ambient temperature.
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Hoffman Christopher J.
O'Connor Kevin
Gandhi Jayprakash N
Pacific Star Communications
Perkins Coie LLP
Portland Design Studio, Inc.
Smith Courtney
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