Hydraulic and earth engineering – Soil remediation – In situ contaminant removal or stabilization
Patent
1996-09-09
1997-11-18
Suchfield, George A.
Hydraulic and earth engineering
Soil remediation
In situ contaminant removal or stabilization
166 53, 166267, 210170, 210747, 210767, 210787, B09C 100, C02F 140, E21B 4334
Patent
active
056880766
ABSTRACT:
Systems and techniques for remediation of soil, vapor and groundwater contaminated with hydrocarbons. The system is ideally suited for easy integration into a mobile remediation unit that uses a liquid ring vacuum pump to extract a contaminated mixture from a sub-surface formation and direct it into a separator, which also serves to shield the high-flow vacuum pump from non-gaseous phases of the contaminated matter that would otherwise reduce its efficiency. Cooling systems are employed to render the unit more independent and self-contained, and an automatic vent and low-shear pump-down cycle is used to transfer liquid phases to fractionation subsystems with minimal emulsification.
REFERENCES:
patent: 5050676 (1991-09-01), Hess et al.
patent: 5358357 (1994-10-01), Mancini et al.
patent: 5387057 (1995-02-01), Deloach
patent: 5441365 (1995-08-01), Duffney et al.
patent: 5529121 (1996-06-01), Partridge et al.
Process Flow & Instrumentation Diagram, Oct. 19, 1994 Atkins & Fly, Inc., Boerne, Texas.
"Vacu-Pont Technology," W.E.S., Inc., Advertising Material, (undated).
"Fluid-Vac Liquid Ring Pumps For Environmental Applications," Atlantic Fludics, Advertising Material, (undated).
Colton Wayne J.
Quirk, IV William H.
Suchfield George A.
LandOfFree
High-vacuum groundwater and soil remediation system and related does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High-vacuum groundwater and soil remediation system and related , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-vacuum groundwater and soil remediation system and related will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1561037