Multiplex communications – Communication over free space – Combining or distributing information via time channels
Reexamination Certificate
2005-01-25
2005-01-25
Vu, Huy D. (Department: 2665)
Multiplex communications
Communication over free space
Combining or distributing information via time channels
C370S474000
Reexamination Certificate
active
06847628
ABSTRACT:
In a TDMA/TDD communication system, uplink RF bursts are received by a number of antennas. Each RF burst contains TDMA signals identified by mobile-terminal identifiers. From each RF burst, the strength of the TDMA signals are detected and compared with the strengths of other RF bursts. For each mobile-terminal identifier, one antenna is selected as a best antenna with the highest strength, and a unique relationship is established in a memory between the selected antenna and the mobile-terminal identifier. A downlink TDM signal is disassembled into time slot signals, which are assembled, according to the relationships established in the memory, into N multicast burst groups. N is equal to the number of antennas selected during the uplink interval. An overhead is inserted to a header portion of each burst group. Overhead-inserted burst groups are converted into RF bursts during a downlink interval of the frame and are transmitted.
REFERENCES:
patent: 5696798 (1997-12-01), Wright et al.
patent: 5822313 (1998-10-01), Malek et al.
patent: 6032033 (2000-02-01), Morris et al.
patent: WO 9608089 (1996-03-01), None
patent: 10-51365 (1998-02-01), None
patent: WO 9602984 (1996-02-01), None
NEC Corporation
Nguyen Toan D.
Sughrue & Mion, PLLC
Vu Huy D.
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