High throughput plasma treatment system

Details High throughput plasma treatment system High throughput plasma treatment system

2007-04-10

2007-04-10

Moore, Karla (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With means for passing discrete workpiece through plural...

C156S345320, C118S719000, C414S939000

Reexamination Certificate

active

10952659

ABSTRACT:
A method for the plasma treatment of parts. The method includes sending loading signals from an electronic control to a transfer mechanism and loading the parts from a position outside of the treatment chamber to a plurality of treatment positions within the treatment chamber based on the loading signals. A plasma is generated within the treatment chamber to treat the parts. After treatment, unloading signals are sent from the electronic control to the transfer mechanism and the parts are unloaded from the treatment chamber based on the unloading signals. Each of the parts may be guided to a corresponding one of the treatment positions during loading.

REFERENCES:
patent: 3294670 (1966-12-01), Charschan et al.
patent: 3641973 (1972-02-01), Shrader
patent: 4208159 (1980-06-01), Uehara et al.
patent: 4226208 (1980-10-01), Nashida et al.
patent: 4252595 (1981-02-01), Yamamoto et al.
patent: 4278528 (1981-07-01), Kuehnle et al.
patent: 4318767 (1982-03-01), Hijikata et al.
patent: 4336438 (1982-06-01), Uehara et al.
patent: 4381965 (1983-05-01), Maher et al.
patent: 4405435 (1983-09-01), Tateishi et al.
patent: 4418639 (1983-12-01), Wills et al.
patent: 4550239 (1985-10-01), Uehara et al.
patent: 4550242 (1985-10-01), Uehara et al.
patent: 4575299 (1986-03-01), Layton et al.
patent: 4584045 (1986-04-01), Richards
patent: 4637853 (1987-01-01), Bumble et al.
patent: 4705444 (1987-11-01), Tullis et al.
patent: 4715921 (1987-12-01), Maher et al.
patent: 4770121 (1988-09-01), Ebata et al.
patent: 4816116 (1989-03-01), Davis
patent: 4816638 (1989-03-01), Ukai et al.
patent: 4840702 (1989-06-01), Schumacher, III
patent: 4889609 (1989-12-01), Cannella
patent: 5030056 (1991-07-01), Kitayama et al.
patent: 5044871 (1991-09-01), Davis et al.
patent: 5079031 (1992-01-01), Yamazaki et al.
patent: 5086729 (1992-02-01), Katagiri
patent: 5116640 (1992-05-01), Mikami et al.
patent: 5216223 (1993-06-01), Straemke
patent: 5259942 (1993-11-01), Kempf
patent: 5286296 (1994-02-01), Sato
patent: 5288684 (1994-02-01), Yamazaki et al.
patent: 5292393 (1994-03-01), Maydan
patent: 5302077 (1994-04-01), Sato
patent: 5303671 (1994-04-01), Kondo et al.
patent: 5310410 (1994-05-01), Begin
patent: 5314298 (1994-05-01), Kim
patent: 5345056 (1994-09-01), Frei et al.
patent: 5364481 (1994-11-01), Sasaki et al.
patent: 5387265 (1995-02-01), Kakizaki et al.
patent: 5433371 (1995-07-01), Morisako
patent: 5480052 (1996-01-01), Furr et al.
patent: 5492265 (1996-02-01), Wandke
patent: 5505777 (1996-04-01), Ciardella et al.
patent: 5515986 (1996-05-01), Turlot et al.
patent: 5534068 (1996-07-01), Beach et al.
patent: 5542559 (1996-08-01), Kawakami et al.
patent: 5573597 (1996-11-01), Lantsman
patent: 5576629 (1996-11-01), Turner et al.
patent: 5587205 (1996-12-01), Saito et al.
patent: 5593539 (1997-01-01), Kubota et al.
patent: 5609290 (1997-03-01), Bobbio et al.
patent: 5634765 (1997-06-01), Miyoshi
patent: 5647942 (1997-07-01), Haji
patent: 5707485 (1998-01-01), Rolfson et al.
patent: 5767008 (1998-06-01), Haji
patent: 5773088 (1998-06-01), Bhat
patent: 5779807 (1998-07-01), Dornfest et al.
patent: 5823416 (1998-10-01), Haji
patent: 5958510 (1999-09-01), Sivaramakrishnam et al.
patent: 5972163 (1999-10-01), Haji
patent: 6093904 (2000-07-01), Haji
patent: 6331347 (2001-12-01), Haji
patent: 3935002 (1991-04-01), None
patent: 59-164696 (1984-09-01), None
patent: 03-023137 (1991-01-01), None
patent: 03-159143 (1991-07-01), None
patent: 04-123430 (1992-04-01), None
patent: 04-311044 (1992-11-01), None
patent: 6-21032 (1994-01-01), None
patent: 2828066 (1998-09-01), None
Panasonic Factory Automation Company,Plasma Cleaning Systems, Brochure, Nov. 2000.
Panasonic Factory Automation Company, Japanese Brochure, Nov. 2000.
March Instruments, Inc.,In-Line Plasma System, Brochure, Aug. 1995.
March Instruments, Inc.,TEC Technology Advancement Center, Brochure, Feb. 1995.
Materials Research Corporation,1.12 Inline production magnetron sputtering, Journal Article, 3 pages.
Von Dr.-Ing M. Nowottnick, Fraunhofer-Einrichtung fur Zuverlassigkeit und Mikrointegration (IZM), Berlin,Plasmabehandlung als umweltfreundliche Alternative in der Leiterplattenfertigung, Galvanotechnik D-88348 Saulgau 86 (1995) Nr. 4; Journal Article, 6 pages.

Affiliated with

Also associated with

Rating

High throughput plasma treatment system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High throughput plasma treatment system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High throughput plasma treatment system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3734863