Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1996-09-06
1998-06-30
Breneman, R. Bruce
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
438697, 438725, 438722, 438723, 216 38, H01L 2100
Patent
active
057733678
ABSTRACT:
A method to planarize a partially completed semiconductor integrated device includes a first process to etch a first portion of a layer of photoresist on the device, a second process to etch the remaining layer of photoresist and to etch a first portion of an oxide on the device, and a third process to etch a second portion of the oxide layer on the device. The second process achieves an etch rate of approximately 5000 .ANG. per minute and the third process achieves an etch rate of approximately 2000 .ANG. per minute. The second process etches 80% of a targeted layer of oxide and the third process etches the remaining portion of the targeted layer of oxide.
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Alejandro Luz
Breneman R. Bruce
Integrated Device Technology Inc.
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