High throughput planarization etch process for interlayer oxide

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438697, 438725, 438722, 438723, 216 38, H01L 2100

Patent

active

057733678

ABSTRACT:
A method to planarize a partially completed semiconductor integrated device includes a first process to etch a first portion of a layer of photoresist on the device, a second process to etch the remaining layer of photoresist and to etch a first portion of an oxide on the device, and a third process to etch a second portion of the oxide layer on the device. The second process achieves an etch rate of approximately 5000 .ANG. per minute and the third process achieves an etch rate of approximately 2000 .ANG. per minute. The second process etches 80% of a targeted layer of oxide and the third process etches the remaining portion of the targeted layer of oxide.

REFERENCES:
patent: 4732658 (1988-03-01), Lee
patent: 4789427 (1988-12-01), Fujimura et al.
patent: 5175127 (1992-12-01), Manning
patent: 5180689 (1993-01-01), Liu et al.
patent: 5212117 (1993-05-01), Tsuji
patent: 5447598 (1995-09-01), Mihara et al.
patent: 5525192 (1996-06-01), Lee et al.
patent: 5549784 (1996-08-01), Carmody et al.
patent: 5665203 (1997-09-01), Lee et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High throughput planarization etch process for interlayer oxide does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High throughput planarization etch process for interlayer oxide , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High throughput planarization etch process for interlayer oxide will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1858823

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.