High throughput photoreflectance technique and apparatus

Details High throughput photoreflectance technique and apparatus High throughput photoreflectance technique and apparatus

1998-02-17

1999-11-09

Kim, Robert H.

Optics: measuring and testing

Of light reflection

356417, 356432, G01N 2155

Patent

active

059824999

ABSTRACT:
A plurality of PR measurements are simultaneously made at N different spots on a wafer by forming N modulated pump beams and N tunable probe beams, and directing one pump beam and one probe beam so as to form overlapping images at each of the N spots. Each of a like plurality of N photodetectors receives a portion of the corresponding probe beam which is reflected from the surface of the wafer to provide information about the wafer characteristics at each spot. In one embodiment, automatic alignment of the probe and pump beams along a row of N spots is achieved by means of a semi-cylindrical scan head which has an axial cavity overlapping the row of N spots and a plurality of radial cavities organized into separate, but interleaved input and output groups. The cavities of two separate input groups receive optical fibers carrying the probe and pump beams to the row of N spots. The cavities of two separate output groups receive photodetectors for detecting the reflected beam and for monitoring the pump beam. The scan head and/or the wafer are moved relative to one another in order to make measurements at various row locations on the wafer (e.g., to map the wafer).

REFERENCES:
patent: 5255070 (1993-10-01), Pollack et al.
patent: 5255071 (1993-10-01), Pollack et al.
patent: 5260772 (1993-11-01), Pollack et al.
patent: 5270797 (1993-12-01), Pollak et al.
patent: 5287169 (1994-02-01), Pollack et al.

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