High throughput mailing maching timing

Details High throughput mailing maching timing High throughput mailing maching timing

1988-12-28

1990-06-19

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156360, 156364, 1564415, 177 1, B65G 6900

Patent

active

049350781

ABSTRACT:
A mailing machine for high-speed processing of mixed mail, capable of high throughput, and of compact size. It includes mail piece processing at four main stations in a straight-through manner, under positive control at all times by separate drive units at each station, with the sequential processing actions timed to optimize mail piece throughput.

REFERENCES:
patent: 3737158 (1973-06-01), Beery et al.
patent: 3877531 (1975-04-01), Storace et al.
patent: 3981493 (1976-09-01), Klappenecker et al.
patent: 4106972 (1978-08-01), Caudill
patent: 4143981 (1979-03-01), Hansen et al.
patent: 4318540 (1982-03-01), Paananen et al.
patent: 4331328 (1982-05-01), Fasig
patent: 4451027 (1984-05-01), Alper
patent: 4573673 (1986-03-01), Haug
patent: 4573673 (1986-03-01), Haug
patent: 4579054 (1986-04-01), Buan et al.
patent: 4753432 (1988-06-01), Freeman
patent: 4844758 (1989-07-01), Hamamura

Affiliated with

Also associated with

Rating

High throughput mailing maching timing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High throughput mailing maching timing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High throughput mailing maching timing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2258529