High throughput hole forming system with multiple spindles...

Cutting by use of rotating axially moving tool – With work-engaging structure other than tool or tool-support – Having tool-opposing – work-engaging surface

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C408S003000, C408S234000, C409S238000, C269S309000, C248S901000, C014S073500

Reexamination Certificate

active

06325576

ABSTRACT:

TECHNICAL FIELD OF THE INVENTION
This invention relates to the field of high speed drilling systems of the type used in the fabrication and population of printed circuit boards, and more particularly to a high throughput drilling system with multiple spindles per station.
BACKGROUND OF THE INVENTION
Printed circuit boards are typically populated with many surface-mounted circuit devices. Many small holes are formed in the boards to interconnect the layers of the circuit board. Of course, printed circuit board populated with other types of devices also need holes formed in the boards.
Drilling machines are typically used to drill the holes in the printed circuit boards. One exemplary type of system is described in U.S. Pat. No. 4,761,876, the entire contents of which are incorporated herein by this reference.
There has been a dramatic increase in the hole count on printed circuit boards, which makes the cost of drilling the holes a significant part of the total production cost. In addition, hole sizes are getting smaller. Small drills are more expensive and can not be fed with the same velocity as larger drills. Due to this fact, drilling time and cost are further increased.
It is known the multiple spindles can be employed in a drilling system, wherein the spindles are manually positioned in relation to each other. Manual positioning has the drawback of requiring significant setup time, to properly position the spindles. Moreover, each time the spindles are required to drill a new part or image, the spindles must be manually repositioned. This requires a very significant setup time as well.
Methods of producing holes by laser are known. However, laser technology does not offer a solution for producing large holes and holes through multilayer boards.
It would therefore be an advance in the art to provide a high throughput drilling system with increased throughput capacity, and which is capable of forming small as well as larger holes.
It would further be an advance in the art to provide a machine capable of mechanically forming larger as well as smaller holes with high throughput.
SUMMARY OF THE INVENTION
A high throughput hole forming system with multiple spindles per spindle station is described. The system includes a base table and a work piece table for supporting work pieces under process. A first drive system moves the work piece table along a Y axis in relation to the base table. The system includes a plurality of spindle stations, each for processing at least one work piece. A plurality of sets of spindles are provided, each spindle for holding a hole forming tool. Each set includes a spindle at each spindle station. Each set of spindles is bearing mounted on a common linear bearing for linear movement along an X axis which is transverse to the Y axis. The spindles of each set are commonly connected together to form a ganged spindle set. The system further includes a plurality of computer-controllable spindle linear drive systems each for commonly driving a set of the spindles along the X axis. A Z axis drive system is provided for individually driving the spindles along a Z axis which is transverse to the X and Y axis.
The system further comprising a controller for controlling said drive systems to conduct hole forming operations on a plurality of work pieces located at respective ones of the spindle stations, such that a spindle of each set is operated to conduct hole forming operations simultaneously on a single work piece at a given station.
In accordance with another aspect of the invention, a method is described for forming holes in a work piece, comprising a sequence of the following steps:
providing a spindle capable of very high rotational drive rates and a linear drive, for rotating a tool and feeding the tool into and out of a work piece;
providing a selection of tools including a set of drilling tools of various diameters, and at least one router tool;
using one or more tools of the set of drilling tools to drill a set of holes in a work piece having diameters less than a predetermined threshold size; and
using said router tool to form one or more holes of diameters larger than the threshold in a routing operation.


REFERENCES:
patent: 2080643 (1937-05-01), Walther
patent: 2393696 (1946-01-01), Kraut et al.
patent: 2886988 (1959-05-01), Gordon
patent: 2920850 (1960-01-01), Campbell
patent: 3822958 (1974-07-01), Lewis
patent: 3882958 (1975-05-01), Hosaka et al.
patent: 4088417 (1978-05-01), Kosmowski
patent: 4520551 (1985-06-01), Imhof
patent: 4596067 (1986-06-01), Raiteri
patent: 4654956 (1987-04-01), Reed et al.
patent: 4709435 (1987-12-01), Stemler et al.
patent: 4730373 (1988-03-01), Senoh
patent: 4761876 (1988-08-01), Kosmowski
patent: 4786216 (1988-11-01), Kitagawa et al.
patent: 4850754 (1989-07-01), Thornton et al.
patent: 4865494 (1989-09-01), Gudow
patent: 4982831 (1991-01-01), Irie et al.
patent: 5068958 (1991-12-01), Kosmowski
patent: 5075530 (1991-12-01), Lee
patent: 5138903 (1992-08-01), Grossenbacher, Jr. et al.
patent: 5230685 (1993-07-01), Christen et al.
patent: 5529441 (1996-06-01), Kosmowski et al.
patent: 135406 (1989-05-01), None
IBM Technical Disclosure Bulletin vol. 31 No. 11 Apr. 1989 “Gridless Printed Circuit Board Drilling Machine”.
IBM Technical Disclosure Bulletin vol. 33 No. 1A Jun. 1990 “Method for Beveling Edges of Populated Printed Wiring Boards and Beveling Machine”.
IBM Technical Disclosure Bulletin vol. 37 No. 6B Jun. 1994 “Multi-Head Optical Router/Drill Machine”.
European Search Report, Application No. EP 98 30 1681 dated Feb. 21, 2000.
Brochure for MULTIFOR 17, “A High Productivity Drilling Machine Specifically Designed For Processing Small Lots”, 4 pages.
Correspondence dated Dec. 15, 1999 from Stutzer to Joseph L. Reinhart (2 pages).
Correspondence dated Oct. 21, 1999 from Stutzer to Kosmowski (2 pages).
Report Document, Posalux SA, 4 pgs, dated Feb. 27, 1996 (in German).
Translation from German, of Report Document, Posalux SA, dated Feb. 27, 1996.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High throughput hole forming system with multiple spindles... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High throughput hole forming system with multiple spindles..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High throughput hole forming system with multiple spindles... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2565440

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.