High-throughput direct-write electron-beam exposure system and m

Details High-throughput direct-write electron-beam exposure system and m High-throughput direct-write electron-beam exposure system and m

1998-02-05

1999-10-19

Anderson, Bruce C.

Radiant energy

With charged particle beam deflection or focussing

With target means

2504922, 250423F, H01J 3730, H01J 3714

Patent

active

059693622

ABSTRACT:
An electron-beam exposure system includes: (1) a stage for supporting a wafer, (2) a planar electron-beam source that emits multiple electron beamlets toward the stage, (3) an electric-field generator for forming an electric field to accelerate the electrons in the electron beamlets, (4) a magnetic-field generator for forming a magnetic flux in the space between the planar electron-beam source and the wafer stage. The magnetic filed generator is structured and arranged such that the magnetic flux formed thereby is (1) substantially evenly distributed within a plane perpendicular to the optical axis, and (2) of increasing flux density, ranging from a first density in the vicinity of the planar electron-beam source, to a second density (greater than the first density) in the vicinity of the wafer stage. The electrons in the electron beamlets follow the lines of magnetic flux such that the beamlet width is decreased at the stage compared to the beamlet width at the planar electron-beam source. The electron beamlets are preferably individually switchable, on and off, by word lines and bit lines on the planar electron-beam source. To form a desired pattern on a wafer surface, the stage is moved through a small area, while the electron beamlets are modulated as needed to write the desired pattern.

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Saville, Gordon F., et al., Magnetic Funnels for Projection Electron Lithography, American Vacuum Society, J. Vac. Sci. Technol. B 13(6), Nov/Dec 1995, pp. 2424-2427.
Chang, T. H. P., et al., Arrayed Miniature Electron Beam Columns for High Throughput Sub-100 nm Lithography, American Vacuum Society, J. Vac. Sci. Technol. B 10(6), Nov/Dec 1992, pp. 2743-2748.

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