High-throughput bond tool

Details High-throughput bond tool High-throughput bond tool

2011-07-12

2011-07-12

Sells, James (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Chamber enclosing work during bonding and/or assembly

C156S581000, C156S583100, C156S583300

Reexamination Certificate

active

07975744

ABSTRACT:
A substrate bonding apparatus comprises a platen and a press. The press is movable relative to the platen for pressing at least one substrate stack between the press and platen. In one embodiment, a consumable compliant member is disposed between the press and the platen. In another embodiment, the apparatus further comprises a substrate carrier adapted for holding and carrying more than one substrate stack in and out of the apparatus. A method for bonding substrates is also described.

REFERENCES:
patent: 4875966 (1989-10-01), Perko
patent: 4954206 (1990-09-01), Voss
patent: 5641371 (1997-06-01), Sanko
patent: 5942089 (1999-08-01), Sproud et al.
patent: 6481482 (2002-11-01), Shimotomai
patent: 2004/0040659 (2004-03-01), Hasper
patent: 2004/0253473 (2004-12-01), Weekes et al.

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