High throughout screening method and apparatus

Details High throughout screening method and apparatus High throughout screening method and apparatus

2008-04-08

2008-04-08

Shibuya, Mark L. (Department: 1639)

Chemistry: molecular biology and microbiology

Measuring or testing process involving enzymes or...

C506S010000, C506S012000

Reexamination Certificate

active

07354704

ABSTRACT:
High-throughput screening method and apparatus arm described. The method includes placing cells on a substrate defining a plurality of discrete microwells, at a well density of greater than about 100/cm2, with the number of cells in each well being less than about 1000, and where the cells in each well have been exposed to a selected agent. The change in conductance in each well is determined by applying a low-voltage, AC signal across a pair of electrodes placed in that well, and synchronously measuring the conductance across the electrodes, to monitor the level of growth or metabolic activity of cells contained in each well. Also disclosed is an apparatus for carrying out the screening method.

REFERENCES:
patent: 4156180 (1979-05-01), Annen et al.
patent: 4160205 (1979-07-01), Hobbs et al.
patent: 5066372 (1991-11-01), Weetall
patent: 5218312 (1993-06-01), Moro
patent: 5605662 (1997-02-01), Heller et al.
patent: 5643742 (1997-07-01), Malin et al.
patent: 5650061 (1997-07-01), Kuhr et al.
patent: 5739039 (1998-04-01), Girault et al.
patent: 5810725 (1998-09-01), Sugihara et al.
patent: 6235520 (2001-05-01), Malin et al.
patent: 6472144 (2002-10-01), Malin et al.
patent: WO 97/49987 (1997-12-01), None

Affiliated with

Also associated with

Rating

High throughout screening method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High throughout screening method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High throughout screening method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2786837