High thermal resistance backfill material for hybrid UFPA's

Details High thermal resistance backfill material for hybrid UFPA's High thermal resistance backfill material for hybrid UFPA's

1995-03-29

1997-05-06

Niebling, John

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Thermally responsive

438618, H01L 3100, H01L 3115

Patent

active

056270828

ABSTRACT:
A porous film 64 is used to thermally insulate sensing integrated circuitry 44 from pixels 34 of an uncooled IR detector hybrid system 30. The porous film 64 is preferably a silicon-dioxide xerogel. A protective film 65 may be deposited on the porous film 64.

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Hanson, et al., "Low-Cost Uncooled Focal Plane Array Technology", Presented at Detector IRIS Meeting, Bedford, MA: by Defense Systems and Electronics Group; Aug. 17, 1993, pp.1-9.

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