High thermal resistance backfill material for hybrid UFPA's

Details High thermal resistance backfill material for hybrid UFPA's High thermal resistance backfill material for hybrid UFPA's

1995-06-07

1997-08-12

Jackson, Jr., Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

257444, 257467, 257632, H01L 31058, H01L 31101, H01L 3109

Patent

active

056568487

ABSTRACT:
A porous film 64 is used to thermally insulate sensing integrated circuitry 44 from pixels 34 of an uncooled IR detector hybrid system 30. The porous film 64 is preferably a silicon-dioxide xerogel. A protective film 65 may be deposited on the porous film 64.

REFERENCES:
patent: 4080532 (1978-03-01), Hopper
patent: 4745278 (1988-05-01), Hanson
patent: 4792681 (1988-12-01), Hanson
patent: 5235195 (1993-08-01), Tran et al.
patent: 5300807 (1994-04-01), Aklson
patent: 5448015 (1995-09-01), Havemann et al.
patent: 5461003 (1995-10-01), Havemann et al.
patent: 5470802 (1995-11-01), Gnade et al.
patent: 5472913 (1995-12-01), Havemann et al.
patent: 5476817 (1995-12-01), Numata
patent: 5478242 (1995-12-01), Walker et al.
patent: 5494858 (1996-02-01), Gnade et al.
Hanson, et al., "Low-Cost Uncooled Focal Plane Array Technology", Aug. 17, 1993.

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