Compositions: ceramic – Ceramic compositions – Glass compositions – compositions containing glass other than...
Patent
1991-09-23
1993-11-16
Group, Karl
Compositions: ceramic
Ceramic compositions
Glass compositions, compositions containing glass other than...
501 22, 501 47, 501 48, C03C 808, C03C 317
Patent
active
052623645
ABSTRACT:
A glass composition for hermetically sealing to high thermal expansion materials such as aluminum alloys, stainless steels, copper, and copper/beryllium alloys, which includes between about 10 and about 25 mole percent Na.sub.2 O, between about 10 and about 25 mole percent K.sub.2 O, between about 5 and about 15 mole percent Al.sub.2 O.sub.3, between about 35 and about 50 mole percent P.sub.2 O.sub.5 and between about 5 and about 15 mole percent of one of PbO, BaO, and mixtures thereof. The composition, which may also include between 0 and about 5 mole percent Fe.sub.2 O.sub.3 and between 0 and about 10 mole percent B.sub.2 O.sub.3, has a thermal expansion coefficient in a range of between about 160 and 210.times.10-7/.degree.C. and a dissolution rate in a range of between about 2.times.10.sup.- 7 and 2.times.10.sup.-9 g/cm.sup.2 -min. This composition is suitable to hermetically seal to metallic electrical components which will be subjected to humid environments over an extended period of time.
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Brow Richard K.
Kovacic Larry
Chafin James H.
Elliott Russell D.
Group Karl
Moser William R.
The United States of America as represented by the United States
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