High thermal conductivity substrate and the method of brazing a

Details High thermal conductivity substrate and the method of brazing a High thermal conductivity substrate and the method of brazing a

1996-08-12

1998-04-21

Berhane, Adolf

Electric heating

Metal heating

For bonding with pressure

B23K 910

Patent

active

057420211

ABSTRACT:
Temperature gradients between a ceramic substrate of high thermal conductivity and the braze materials used to attach a metallic device such as a cap are reduced by using an embedded internal heat source in the substrate to minimize the thermal gradient, thereby minimizing the stresses that can result in substrate cracking when a cap is brazed onto the substrate.

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"Module Removal By Inlaid Heater Modules", IBM Technical Disclosure Bulletin V12 N8, Jan. 1970, pp. 1193-1194.

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