High thermal conductivity substrate

Details High thermal conductivity substrate High thermal conductivity substrate

1975-09-12

1978-08-01

White, Robert F.

Plastic and nonmetallic article shaping or treating: processes

Pore forming in situ

Of inorganic materials

264 61, 264104, C04B 3552

Patent

active

041043448

ABSTRACT:
A high thermal conductivity substrate is formed by making a sintered diamond composite and thereafter modifying the electrical properties of the composite by leaching graphite and other non-diamond materials from the composite and subsequently infusing the leached composite with material having known electrical properties. Alternatively, a diamond composite having high thermal conductivity known electrical properties is prepared and subsequently leached to remove graphite and other materials which interfere with the known electrical properties of the composite material.

REFERENCES:
patent: 3348918 (1967-10-01), Kruse
patent: 3683469 (1972-08-01), Copek et al.
patent: 3816085 (1974-06-01), Hall
patent: 3819814 (1974-06-01), Pope
patent: 3829544 (1974-08-01), Hall
patent: 3912500 (1975-10-01), Vereschogin et al.

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