High thermal conductivity substrate

Details High thermal conductivity substrate High thermal conductivity substrate

1978-04-03

1979-08-07

White, Robert F.

Plastic and nonmetallic article shaping or treating: processes

Pore forming in situ

Of inorganic materials

264 61, 264104, C04B 3552

Patent

active

041637690

ABSTRACT:
A high thermal conductivity substrate is formed by making a sintered diamond composite and thereafter modifying the electrical properties of the composite by leaching graphite and other non-diamond materials from the composite and subsequently infusing the leached composite with material having known electrical properties. Alternatively, a diamond composite having high thermal conductivity known electrical properties if prepared and subsequently leached to remove graphite and other materials which interfere with the known electrical properties of the composite material.

REFERENCES:
patent: 3348918 (1967-10-01), Kruse
patent: 3683469 (1972-08-01), Copek et al.
patent: 3816085 (1974-06-01), Hall
patent: 3819814 (1974-06-01), Pope
patent: 3829544 (1974-08-01), Hall
patent: 3912500 (1975-01-01), Vereschagin et al.

Affiliated with

Also associated with

Rating

High thermal conductivity substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High thermal conductivity substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High thermal conductivity substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1524931