High thermal conductivity metal matrix composites

Details High thermal conductivity metal matrix composites High thermal conductivity metal matrix composites

2011-08-02

2011-08-02

King, Roy (Department: 1733)

Specialized metallurgical processes, compositions for use therei

Compositions

Consolidated metal powder compositions

C075S243000, C075S249000, C428S539500, C257S706000, C257S720000

Reexamination Certificate

active

07988758

ABSTRACT:
Discontinuous diamond particulate containing metal matrix composites of high thermal conductivity and methods for producing these composites are provided. The manufacturing method includes producing a thin reaction formed and diffusion bonded functionally graded interactive SiC surface layer on diamond particles. The interactive surface converted SiC coated diamond particles are then disposed into a mold and between the particles and permitted to rapidly solidify under pressure. The surface conversion interactive SiC coating on the diamond particles achieves minimal interface thermal resistance with the metal matrix which translates into good mechanical strength and stiffness of the composites and facilitates near theoretical thermal conductivity levels to be attained in the composite. Secondary working of the diamond metal composite can be performed for producing thin sheet product.

REFERENCES:
patent: 3520667 (1970-07-01), Taylor
patent: 3617347 (1971-11-01), Kuratomi
patent: 4606738 (1986-08-01), Hayden
patent: 4643741 (1987-02-01), Yu et al.
patent: 4783368 (1988-11-01), Yamamoto et al.
patent: 4914551 (1990-04-01), Anschel et al.
patent: 5676918 (1997-10-01), Okada et al.
patent: 5735332 (1998-04-01), Ritland et al.
patent: 5783316 (1998-07-01), Colella et al.
patent: 5855967 (1999-01-01), Kirkpatrick
patent: 6106957 (2000-08-01), Fang
patent: 6171691 (2001-01-01), Nishibayashi
patent: 6270848 (2001-08-01), Nishibayashi
patent: 6447852 (2002-09-01), Gordeev et al.
patent: 6673439 (2004-01-01), Miyamoto et al.
patent: 6727117 (2004-04-01), McCoy
patent: 6821495 (2004-11-01), Fukuoka et al.
patent: 6984888 (2006-01-01), Sung
patent: 2001/0015271 (2001-08-01), Lo et al.
patent: 2004/0053039 (2004-03-01), Ekstrom et al.
patent: 0 364 155 (1989-10-01), None
patent: 0 459 474 (1991-05-01), None
patent: 1 143 044 (2001-10-01), None
patent: H10-223812 (1998-08-01), None
patent: 2003-095743 (2003-04-01), None
patent: WO 01/21862 (2001-03-01), None
European Supplementary Search Report, Appln. No. 04809792.7, dated Dec. 29, 2010 (3 pages).
Official Action translation dated Nov. 22, 2010, issued in corresponding Japanese application No. 2006-533975 (1 pg).
U.S. Office Action, U.S. Appl. No. 11/868,664, dated Feb. 2, 2010 (8 pages).
U.S. Office Action, U.S. Appl. No. 11/868,664, dated Aug. 5, 2010 (7 pages).
U.S. Office Action, U.S. Appl. No. 11/868,664, dated Nov. 29, 2010 (8 pages).

Affiliated with

Also associated with

Rating

High thermal conductivity metal matrix composites does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High thermal conductivity metal matrix composites, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High thermal conductivity metal matrix composites will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2714874