High thermal conductivity, matched CTE. low density mounting pla

Details High thermal conductivity, matched CTE. low density mounting pla High thermal conductivity, matched CTE. low density mounting pla

1993-07-28

1995-10-03

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

75243, 75247, 75249, 428565, 428901, H05K 720

Patent

active

054557380

ABSTRACT:
A circuit card assembly thermal core includes a composite material that includes particles of diamond and a conductive metal such as aluminum, copper, nickel and beryllium and which may be made by pressure infiltration casting. The diamond particles are 110 to 160 microns in size and 10 to 80 percent by volume, and preferably 140 to 160 microns in size and 40 to 60 percent by volume. The composite material has both a high thermal conductivity and low density which may be matched with the coefficient of thermal expansion of other materials with which used.

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E. G. Loeffel et al "Heat Transfer Apparatus for Semiconductor Chip", IBM Technical Disclosure Bulletin vol. 21, No. 6, Nov. 1978.

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