High thermal conductivity/low alpha emission molding compound co

Details High thermal conductivity/low alpha emission molding compound co High thermal conductivity/low alpha emission molding compound co

1988-04-12

1990-06-05

Hille, Rolf

357 81, 357 67, H01L 2328, H01L 2330

Patent

active

049318527

ABSTRACT:
The invention discloses an improved integrated circuit package having enhanced thermal conductivity comprising a molding or encapsulation resin having a semiconductor filler material. In a preferred embodiment, the semiconductor filler material comprises a high purity doped semiconductor to reduce alpha errors caused by alpha emisison normally caused by the use of fillers containing trace amounts of radioactive impurities and to provide enhanced thermal conductivity.

REFERENCES:
patent: 4426657 (1984-01-01), Abiru et al.
patent: 4514580 (1985-04-01), Bartlett
Sze--Physics of Semiconductor Devices-2nd ed-John Wiley and Sons, pp. 42-43, 1981.
Wolff--Semiconductors-Wiley-Interscience-p. 92, 1971.

Affiliated with

Also associated with

Rating

High thermal conductivity/low alpha emission molding compound co does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High thermal conductivity/low alpha emission molding compound co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High thermal conductivity/low alpha emission molding compound co will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-495291